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November 5, 2024
Enhancing EV Battery Safety with Vapor Deposition Technology
Enhancing EV Battery Safety with Vapor Deposition Technology
While rare, lithium-ion (Li-ion) battery fires are highly dangerous, posing a risk for OEMs, automakers, and consumers. To tackle this, Soteria Big Consortium, a Greenville, SC–based organization, has pioneered a breakthrough in battery safety technology. Soteria’s solution replaces traditional aluminum and copper foil with a plastic film-based current collector produced through physical vapor deposition. This innovative material can “burn out” around an internal short circuit like a fuse, preventing fires in the event of damage, abuse, or manufacturing defects. Remarkably, Soteria's technology reduces fire risk by over 90%, allowing the cell to continue operating safely. In addition to safety, it boosts energy density and lightens battery weight by 15-20%, thanks to an 80% reduction in metal content.
Amy Brinson, Soteria’s Vice President, will present a case study on this technology at the FabBatt event on November 14, 2024, as part of the Advanced Design & Manufacturing Expo in Montréal. Brinson’s presentation will delve into how this technology could redefine battery safety standards across industries, from automotive to consumer electronics.
With Soteria's cutting-edge approach, industries stand to benefit from improved safety, efficiency, and sustainability in battery technology, underscoring the potential for widespread adoption of safer, lighter Li-ion batteries. Learn more about this topic here.
Amy Brinson, Soteria’s Vice President, will present a case study on this technology at the FabBatt event on November 14, 2024, as part of the Advanced Design & Manufacturing Expo in Montréal. Brinson’s presentation will delve into how this technology could redefine battery safety standards across industries, from automotive to consumer electronics.
With Soteria's cutting-edge approach, industries stand to benefit from improved safety, efficiency, and sustainability in battery technology, underscoring the potential for widespread adoption of safer, lighter Li-ion batteries. Learn more about this topic here.
November 23, 2024
Advancing AI Semiconductors: Revolutionizing Fabrication with PECVD
Advancing AI Semiconductors: Revolutionizing Fabrication with PECVD
The accelerating demand for high-performance semiconductors in artificial intelligence (AI) has driven the need for breakthroughs in materials and manufacturing techniques. A groundbreaking development led by Senior Researcher Hyeong-U Kim of the Korea Institute of Machinery and Materials (KIMM) and Professor Taesung Kim of Sungkyunkwan University has achieved a world-first: fabricating 4-inch heterostructure wafers using plasma-enhanced chemical vapor deposition (PECVD).
This innovation marks a significant step forward in the creation of low-power, high-performance semiconductors. Utilizing PECVD, the team developed two advanced heterostructures. The first involves combining tungsten disulfide (WS₂) with graphene through a process that deposits a tungsten layer and sulfurizes it via hydrogen sulfide plasma. The second integrates distinct phases of molybdenum disulfide (MoS₂), including the challenging metastable 1T phase, to create a wafer-scale 1T-2H heterostructure.
Conventional heterostructure fabrication, limited to micrometer scales and plagued by reproducibility challenges, is surpassed by this PECVD-based technique. It enables the production of wafer-scale heterostructures with consistent quality, meeting industrial standards. Moreover, these heterostructures pave the way for advanced 3D integrated semiconductor structures that minimize power loss and heat dissipation, enhancing efficiency—a crucial factor for AI applications.
By leveraging PECVD, a widely adopted semiconductor tool, this technology offers scalability and potential for mass production. KIMM’s patented methods promise to propel AI semiconductor innovation, bridging academic research and industrial commercialization. This development represents a significant milestone in the pursuit of energy-efficient, next-generation computing solutions. Learn more here
This innovation marks a significant step forward in the creation of low-power, high-performance semiconductors. Utilizing PECVD, the team developed two advanced heterostructures. The first involves combining tungsten disulfide (WS₂) with graphene through a process that deposits a tungsten layer and sulfurizes it via hydrogen sulfide plasma. The second integrates distinct phases of molybdenum disulfide (MoS₂), including the challenging metastable 1T phase, to create a wafer-scale 1T-2H heterostructure.
Conventional heterostructure fabrication, limited to micrometer scales and plagued by reproducibility challenges, is surpassed by this PECVD-based technique. It enables the production of wafer-scale heterostructures with consistent quality, meeting industrial standards. Moreover, these heterostructures pave the way for advanced 3D integrated semiconductor structures that minimize power loss and heat dissipation, enhancing efficiency—a crucial factor for AI applications.
By leveraging PECVD, a widely adopted semiconductor tool, this technology offers scalability and potential for mass production. KIMM’s patented methods promise to propel AI semiconductor innovation, bridging academic research and industrial commercialization. This development represents a significant milestone in the pursuit of energy-efficient, next-generation computing solutions. Learn more here
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