To learn more about our company's Vacuum Deposition services, click here.
Scroll down for more content!
Scroll down for more content!
August 4, 2025
AIXTRON to Take Advantage of AI boom with Datacom Laser Technology
AIXTRON to Take Advantage of AI boom with Datacom Laser Technology
AIXTRON SE is solidifying its leadership in the semiconductor sector with its G10-AsP system, a state-of-the-art metal-organic chemical vapor deposition (MOCVD) platform driving AI-driven datacom laser manufacturing. Datacom lasers are critical for AI data centers, where rapid growth in data processing demands highly uniform, scalable production. The G10-AsP, recognized as the industry “tool of record,” delivers fourfold improved on-wafer uniformity and full cassette-to-cassette automation, enabling manufacturers to efficiently scale high-performance laser production. H1 2025 order intake reached EUR 250.7 million, underscoring strong market adoption.
Beyond datacom lasers, AIXTRON leverages MOCVD technology across photonics and power electronics. Its system supports indium phosphide (InP)-based photonic integrated circuits (PICs), essential for 5G/6G networks, healthcare applications, and AI. Companies like SMART Photonics are using the G10-AsP to scale InP PIC production, overcoming bottlenecks in the photonics value chain. The InP PIC market is projected to grow at a 14% CAGR through 2027, highlighting significant long-term opportunity.
In power electronics, AIXTRON addresses the shift to gallium nitride (GaN) and silicon carbide (SiC). The company recently processed a 300mm GaN wafer at its Innovation Center, demonstrating readiness to meet rising demand for efficient next-generation power solutions. Learn more here.
Beyond datacom lasers, AIXTRON leverages MOCVD technology across photonics and power electronics. Its system supports indium phosphide (InP)-based photonic integrated circuits (PICs), essential for 5G/6G networks, healthcare applications, and AI. Companies like SMART Photonics are using the G10-AsP to scale InP PIC production, overcoming bottlenecks in the photonics value chain. The InP PIC market is projected to grow at a 14% CAGR through 2027, highlighting significant long-term opportunity.
In power electronics, AIXTRON addresses the shift to gallium nitride (GaN) and silicon carbide (SiC). The company recently processed a 300mm GaN wafer at its Innovation Center, demonstrating readiness to meet rising demand for efficient next-generation power solutions. Learn more here.
© Copyright BHC Associates Inc. 2014-2025 All rights reserved.